pressure bonding

Using the hot embossing machine as the thermal bonding device, effects of the bonding temperature, pressure and time on the deformation of microchannel dimensions are systematically studied using the orthogonal factorial design.

使用热压机作为热键合设备，采用正交试验设计方法，系统地研究了键合温度、压强和时间对于热键合过程中微沟道变形的影响；

Other dissimilar materials bonding can benefit by pressure brazing.

压力钎焊也有助于其它异种材料的连接.

Measurement of Pressure Field of Bonding Region in Explosive Welding with Manganin Pressure Gauge

爆炸焊接结合区压力场的锰铜压力量计测量

Films for lamination were prepared via a melt blending of thermoplastic polyurethane ( TPU) and polyester with low melt point, and their moisture permeability, thermal bonding properties, resistance to hydrostatic pressure and mechanical properties were tested.

用低熔点聚酯对热塑性聚氨酯进行改性，并对所制备的复合薄膜进行热粘合强度、DSC、透湿性、耐静水压以及力学等各项性能测试。

Of process parameters on the bonding strength of coating from the primary to the meeting were: spray distance, atomization air pressure, spray voltage, spray current.

工艺参数对涂层结合强度的影响由主到次依次为：喷涂距离、雾化空气压力、喷涂电压、喷涂电流。

In piezoresistive pressure sensor packaging process, the thermocompression wire bonding was studied to meet the outer interconnection of silicon gauge.

为满足压阻式压力传感器封装工艺中硅芯片外引线键合的要求，研制了热压焊简易装置；

In this paper we reported the process and principle of large-area GaAs epitaxial plate thermocompression bonded to K4 window-glass technology, and emphatically discussed the effects of the deposition of SiN film, the controlling of bonding temperature and the choice of pressure on bonding quality.

本文报道制备GaAs透射式光阴极过程中窗玻璃与大面积GaAs外延片热压粘结工艺的原理和过程，并重点分析抗反射膜的淀积、粘结温度控制和压力大小对粘结结果的影响。

Study on Thermosonic Flip Chip Bonding under Pressure Constraint Pattern

压力约束模式下热超声倒装键合的试验

It is introduced that a new type of material, self-luminescent lamp-box cloth, has been manufactured by taking PVC paste resin as the main raw material and adopting the hot-pressure bonding and blade coating process.

介绍了以PVC糊树脂为主要原料，采用贴合刮涂法生产新型材料&发光灯箱布的工艺。

The pressure field of bonding region in explosive welding has been measured with a manganin pressure gauge.

用锰铜压力量计测得了爆炸焊接结合区的压力场。